![]() The pad itself was not maintaining contact to the center of the X570 chip at all! Over time (a few weeks after manufacturing probably), the thermal pads lost contact with the X570 chip! When I took my pads off, there was just a thick layer of pad residue touching the surface of the chip, as well as the shape of the chip engraved into the pad. ![]() What's happening is that the pads have a crazy amount of residue on them, and they compress really easily, maintaining their form once compressed. It turns out that the thermal padding that ASUS is using is absolutely awful. I saw there were many people with different X570 boards that had only 60c temperatures where as I was always at 72+c, so I did some investigating.
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